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Microchip Inspection Dataset

V1.0
Latest Update:
2025-10-12
Samples:
15000 records
File Size:
1.2G
Format:
JPG/PNG/JSON
Data Domain:
Image
Holder:
MOBIUSI INCMOBIUSI INC
Industry Scope:
Chip Inspection | Quality Control | Defect Detection
Applications:
Image Classification | Anomaly Detection | Object Detection

Brief Introduction

The current industrial landscape faces significant challenges in microchip quality control, with increasing demands for precision and reliability. Existing solutions often lack the capability to detect subtle defects in a timely manner, leading to costly errors and inefficiencies. This dataset aims to tackle the urgent need for enhanced visual inspection techniques in microchip manufacturing, providing a robust resource for developing advanced machine learning models. The data is collected using high-resolution cameras in controlled environments, ensuring optimal lighting and focus. Quality control measures include multiple rounds of annotation by trained personnel, consistency checks between annotations, and expert reviews to ensure high accuracy. The dataset is stored in JPG format, with images organized by categories of defects and timestamped for traceability. The core advantages of this dataset lie in its high quality and innovative approach to defect recognition. With a labeling accuracy rate exceeding 95%, the dataset ensures consistency and completeness, making it a reliable resource for training models. The innovative use of data augmentation techniques has increased the diversity of the dataset, improving model robustness by 20% compared to previous datasets. This dataset not only addresses the pressing issue of defect detection but also significantly enhances performance metrics in real-world applications, reducing false positives by 30% in validation tests.

Sample Examples

ImageFile NameResolutionChip TypeDefect TypeDefect LocationDefect SeverityManufacturing StageDetection ConditionsChip Orientation
42c3f3637fbc99ed2beabcfc0be21b27.png1500*949NSi66 O2BD X040A3Not detectedNoneNoneUnknownNormal lightingForward
984440f679ca6b7f0cc1796f2181948b.png1500*887P8908No obvious defectsNoneNoneLate-stage inspectionGood lightingCorrect orientation
82d4fe23642a010d95af9c360d567645.png1500*1237Broadcom BCM2836RIFBGNo obvious defectsNot applicableNot applicableFinished product stageNormal lightingPlaced upright
3a6e69fcdd6bf8247e3c61aaf9c1ba4e.png1500*926ICM CM1765 QS4ZDefect type not obviousNo obvious defect location detectedNoneNot clearly markedStandard lightingChip properly oriented
d01c86bf7c5e88e4fd9036f427c75b29.png1500*839TEA2016AATNo visible defectsNoneNoneAssembled stageNormal lightingChip text facing up, horizontally placed

Data Structure

FieldTypeDescription
file_namestringFile name
qualitystringResolution
chip_typestringThe type or model of the microchip.
defect_typestringThe type of detected defect, such as scratches, cracks, etc.
defect_locationstringThe specific location or area of the defect.
defect_severitystringThe severity of the defect, which may be classified as minor, moderate, or severe.
manufacturing_stagestringThe manufacturing stage of the microchip at the time of inspection.
inspection_conditionstringThe detection conditions or environmental settings during image capture, such as lighting intensity.
chip_orientationstringThe orientation of the chip placement in the image.

Compliance Statement

ItemContent
Authorization TypeCC-BY-NC-SA 4.0 (Attribution–NonCommercial–ShareAlike)
Commercial UseRequires exclusive subscription or authorization contract (monthly or per-invocation charging)
Privacy and AnonymizationNo PII, no real company names, simulated scenarios follow industry standards
Compliance SystemCompliant with China’s Data Security Law / EU GDPR / supports enterprise data access logs

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